5/5/2017

Diamond Compound Polishes without Harming Finishes

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Hyprez SC diamond polishing compound from Engis is specifically designed for mold and die polishing, offering increased removal rates on mold and die steels without sacrificing finishes.

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Hyprez SC diamond polishing compound from Engis is specifically designed for mold and die polishing, offering increased removal rates on mold and die steels without sacrificing finishes. The compound uses a sharper sharper diamond type and special particle size distribution for optimized cutting action, the company says. The SC carrier provides increased lubricity without being “greasy” or spinning off the felt or wood bob. It also resists vaporizing at higher temperatures, making it well-suited for polishing large molds in situ. The results are faster cutting rates, better finishes and the ability to skip polishing steps, the company says.  Jobs also can be finished quicker, reducing turnaround times. 

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