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DMG/Mori Seiki USA Plans May Innovation Days Event
DMG/Mori Seiki USA will host Innovation Days 2013 at its U.S. headquarters near Chicago, Illinois May 7-10.
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Editorial Director,
MoldMaking Technology
DMG/Mori Seiki USA will host Innovation Days 2013 at its U.S. headquarters near Chicago, Illinois May 7-10. The company anticipates that the event will be its largest U.S. open house to date. The show will feature more machines and seminars than previous years, and will last for an additional day. Attendees will have access to more than 40 machining demonstrations and one-on-one application consultations. Showcased industries will include aerospace, automotive, die and mold, gear production, medical, dental, heavy industry, and general machining.
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