Modeling Paste

Huntsman® Advanced Materials (The Woodlands, TX) offers—within the Renshape® Solutions range—RenPaste® Seamless Modelling Paste (SMP), a fast and efficient alternative to traditional modelling techniques.

Huntsman® Advanced Materials (The Woodlands, TX) offers—within the Renshape® Solutions range—RenPaste® Seamless Modelling Paste (SMP), a fast and efficient alternative to traditional modelling techniques. The RenPaste® SMP range is suitable for a number of applications, including those that match the very particular demands of the marine, automotive and wind energy sectors.

These cost-effective epoxy SMPs, include those suitable for fast extrusion via CNC machines for the rapid production of large models and plugs up to 36m in length. In addition to this, the range comprises a high temperature SMP having a heat deflection capacity of up to 200°C for making high temperature resistant tools.

RenPaste® 4666, the most recent addition to the SMP range, has been designed for modern automated rapid manufacturing systems while still being suitable for refined hand application as well. This has been achieved through using the "chemical thixotropy", a unique and patented solution developed by Huntsman that enables the user to alter the SMP rheology by simply changing the mixing parameters. This Programmable Paste Rheology (PPR) concept changes the SMP’s characteristics from a fluid that can be applied very fast in thickness of 10mm, to a viscous material capable of up to 40mm thick, with no slump on vertical surfaces and without excessive exotherm. The user can select the paste rheology required for individual jobs – from high speed automated application to thick hand application.

No matter the application, its high quality, resulting from the adjustable rheology, reduces the need for additional repairs or re-working of the model. In addition, the fine surface quality obtained after milling of RenPaste® 4666 reduces any further finishing time. The paste also exhibits excellent dimensional stability and low shrinkage on precision models.

RenPaste® 4666 offers excellent adhesion to polystyrene (material often used as a lightweight and cost-effective substrate for SMP application). It cures rapidly at room temperatures (can be machined after 24 hours only) and reach heat resistance up to 80°C after a suitable post cure.