Dow Commits to Underwrite Antec® Program at NPE 2012

Dow’s commitment also includes the SPI Technical Education Program and Technololgy Central

The Dow Chemical Company will be the exclusive corporate sponsor of the Technical Education Program and Technology Central at the NPE2012 international plastics exposition, it was announced today by SPI: The Plastics Industry Trade Association. NPE2012 will take place April 1-5, 2012 at the Orange County Convention Center (OCCC) in Orlando, Florida, with exhibit halls opening on April 2.

Dow will be the exclusive corporate underwriter of the Society of Plastics Engineers (SPE) ANTEC® 2012, which will be co-located with the NPE trade show. ANTEC will include more than 500 original peer-reviewed technical presentations.

In addition, Dow will sponsor what SPI has dubbed Technology Central in the North-South Hall of the OCCC. This will include SPI’s 2nd International Plastics Design Competition, four multi-exhibitor specialty pavilions, and a technology theater for presentations and demonstrations by exhibitors.   

In addition to Dow’s underwriting commitment, Dow will directly participate in NPE2012 and the co-located ANTEC conference:

 ·        Fourteen Technical Papers. Representatives of Dow’s Performance Plastics Division will make these presentations at SPE ANTEC 2012.

 ·        On-Site Processing of Dow’s Resins. At least eight global machinery manufacturers will be demonstrating production on the exhibit floor.

“Dow’s extensive involvement in the major NPE2012 programs is a way for us to support the industry and keep it strong, innovative, and growing,” said Mauro Gregorio, Commercial Vice President for Dow’s North America Performance Plastics. “We are particularly interested in the emphasis on innovation woven throughout many of the programs planned for NPE and we will make our contribution through presentations on a number of relevant topics.”

 NPE is a triennial exposition founded and produced by SPI. “Dow’s extensive participation in NPE2012 reflects a strong involvement by resin manufacturers in general,” said Gene Sanders, SPI Executive Vice president of Trade Shows and Conferences. “Participation by these companies will be greater than it was at NPE2009 and include not just booths on the show floor but also customer hospitality centers nearby in the convention center, conference presentations, and special-program displays.”